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What are the characteristics of multi-layer circuit board proofing

September 19, 2022

   1. CAM optimization
Generally speaking, in order to obtain high-quality multi-layer circuit board proofing, it is necessary to perform corresponding CAM processing during its production. When doing CAM processing, it is first to make appropriate compensation for its line width, and then to ensure spacing and welding. disk optimization. Therefore, only by optimizing the CAM process, the circuit of the multi-layer circuit board can obtain a better signal, thereby ensuring the quality of the multi-layer circuit board proofing.


   2, the process is reasonable
For high-quality multi-layer circuit board proofing, it is necessary to ensure that its process is reasonable. It can be judged by observing the regularity of the device. After the proofing is reflowed and wave soldered, the device is very regular, and the tin is good. There will be no connection. phenomenon of welding


   3. Neat appearance
The product that has been proofed by the multilayer circuit board must first observe whether the appearance is flat, whether there are burrs in each corner, whether there are holes in the PTH hole, and also whether the substrate of the multilayer board, the surface of the wire and the solder mask are related. There is no blistering or bubbling and delamination between, and there is no wave, wrinkle, or pattern on the solder mask.

 

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