Shenzhen Senyan Circuit Co., Ltd. 86-755-26644463 sales06@senyanpcb.com
Custom Round PCB Board 1Oz 1.6mm Printed Circuit Board Assembly

Custom Round PCB Board 1Oz 1.6mm Printed Circuit Board Assembly

  • High Light

    1Oz round pcb board

    ,

    OSP round pcb board

    ,

    1.6mm Printed Circuit Board Assembly

  • Material
    FR4,Aluminum
  • Board Thickness
    1.6mm
  • Copper Thickness
    1 OZ
  • Cover Film
    Green/White/Black
  • Silkscreen Color
    White
  • Surface Technics
    OSP/ Immersion Gold
  • Min Holes
    0.5mm
  • Min Line Space And Width
    10/10mil
  • Name
    1 Layer Pcb
  • Place of Origin
    China
  • Brand Name
    SenYan
  • Certification
    ISO14001,ISO13485,ISO9001,IATF16949
  • Model Number
    1 layer pcb
  • Minimum Order Quantity
    1pcs
  • Price
    Negotiate
  • Packaging Details
    PCB: Vacuum Packing / PCBA: ESD Packing
  • Delivery Time
    1-30days
  • Payment Terms
    L/C, D/A, D/P, T/T
  • Supply Ability
    100000pcs

Custom Round PCB Board 1Oz 1.6mm Printed Circuit Board Assembly

Custom Round Pcb Led Pcba Bare Pcb Printed Circuit Board Assembly Manufacturer Service

The competitive advantage of product line:

Shenzhen SenYan Circuit Co.,Ltd.(Shenzhen) is one of Chinese leading electronic O E M contract provider services including PCB & PCB assembly. With many years experience in PCB & PCBA developing and exporting.

SENYAN offers pcb productiong services from 1-20 layer rigid circuit board,

1-4 layer flexible pcb board. 1-2layer aluminum PCB

The materials includes standard FR4,FR1,CEM-1,

CEM-3, hight TG, Aluminum , FPC,polyimide, Teflon and so on.

Production Capacity:

Product Line Name Production Line Capacity Actual Units Produced(Previous Year)
PCBA, PCB PCB: 10000 m2 Per Month ;PCBA: 100000 m2 Per Month PCB: 10000 m2 ;PCBA: 20000 m2

 

Short Lead Time:

Products Name Order(in the last 12month) Shortest Lead Time
PCB 1 m2 2 Days
PCBA 1 m2 5 Days

 

Custom Round PCB Board 1Oz 1.6mm Printed Circuit Board Assembly 0

SMT Manufacturing Capability

Item
Manufacturing Capability in process
Manufacturing Method
Production size(Min/Max)
50×50mm / 500×500mm
 
Production board thickness
0.2 ~ 4mm
 
 
 
 
 
 
Printing solder paste
Support method
 
Magnetism fixture, vacuo platform
 
 
Clamping method
 
Sticking up by vacuo, clamping on both sides ,flexible clamping with sheet, flexible clamping with thick board
Cleaning Method of printing solder paste
 
Dry method+ wetting method+ Vacuo method
Accuracy of printing
±0.025mm
 
SPI
Repeated accuracy of volume
<1% at 3σ
 
 
 
Mounting component
Components size
0603(Option) L75mm Connector
 
Pitch
0.15mm
 
Repeated accuracy
±0.01mm
 
 
AOI
FOV size
61×45mm
 
Test speed
9150mm²/Sec
 
3D X-ray
Shootingangle
0-45
 
Rigid RPCB Manufacturing Capability

Rigid PCB Manufacturing Capability

 
Item
RPCB
HDI
minimum linewidth/linespacing
3MIL/3MIL(0.075mm)
2MIL/2MIL(0.05MM)
minimum hole diameter
6MIL(0.15MM)
6MIL(0.15MM)
minimum solder resist opening (single-side)
1.5MIL(0.0375MM)
1.2MIL(0.03MM)
minimum solder resist bridge
3MIL(0.075MM)
2.2MIL(0.055MM)
maximum aspect Ratio (thickness/hole diameter)
10:1
8:1
impedance control accuracy
+/-8%
+/-8%
finished thickness
0.3-3.2MM
0.2-3.2MM
maximum board size
630MM*620MM
620MM*544MM
maximum finished copper thickness
6OZ(210UM)
2OZ(70UM)
minimum board thickness
6MIL(0.15MM)
3MIL(0.076MM)
maximum layer
14
12
Surface treatment
HASL-LF,OSP ,Immersion Gold, Immersion Tin ,Immersion Ag
Immersion Gold,OSP,selectiveimmersion gold,
carbon print
Min/max laser hole size
/
3MIL / 9.8MIL
laser hole size tolerance
/
10%

 

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