There are many English words with uppercase and lowercase letters in the PCB industry, or words with English letters and numbers. Many novices who have just entered the industry often do not understand what they mean. Let the editor take stock of the English vocabulary that is often used in the PCB industry for you:
1. CCL: short for circuit board factory, or copper clad laminate.
2. Tg: Glass transition temperature, which is the temperature at which a glassy substance transforms between a glassy state and a highly elastic state (commonly known as softening). The higher the Tg value, usually the better the heat resistance and dimensional stability.
3. CTI: relative leakage index, the unit is V.
4. CTE: coefficient of thermal expansion, the lower the CTE value, the better the dimensional stability, and vice versa.
5. TD: thermal decomposition temperature, which refers to the temperature at which the base material resin loses 5% of its weight when heated.
6. CAF: Resistance to ion migration refers to the state in which dendritic metal is precipitated between the wires under the action of an electric field after a voltage is applied to circuits that are close to each other and parallel to each other on the printed board, or the glass along the substrate The migration of metal ions occurs on the fiber surface.
7. T288: It is a technical index reflecting the welding resistance condition of the printed board base material, which refers to the longest time for the base material of the printed board to withstand the high temperature of welding under the condition of 288 ° C without causing decomposition phenomena such as blistering and delamination .
8. DK: dielectric constant, often called dielectric constant.
9. DF: Dielectric loss factor refers to the ratio of the energy that has been lost in the insulating sheet in the signal line to the energy still in the line.
10. OZ: "Ounce" in Chinese is an imperial unit of measurement, and it is also called Yingliang when used as a unit of weight; 10Z means the thickness of copper with a weight of 10Z evenly spread on an area of 1 square foot (FT2). The average thickness of the copper foil is represented by the weight per unit area.
11. ED copper foil: electrolytic copper foil, copper foil commonly used in PCB.
12. RA copper foil: rolled copper foil, commonly used in FPC.
13. Drum Side: smooth surface, smooth surface of electrolytic copper foil
14. Matt side: rough surface, rough surface of electrolytic copper foil
15. Cu: The element symbol of copper, the atomic weight is 63.5, and the density is 8.89 g/cubic centimeter.
16. PREPREG: prepreg, referred to as PP.
17. DICY: Dicyandiamide, a common curing agent.
18. R.C: resin content.
19. R.F: Resin fluidity.
20. G.T: gel time.
21. V.C: Volatile content.
