PCB manufacturing-Double-Sided PCB

Item No.: Double-Sided PCB
  • Material:
    Fr4
  • Layers:
    2 Layers
  • Craft:
    Lead-free HASL
  • Features:
    94V0 PCB
Description
Description

Power Bank Power Supply AC Circuit Board Double Side PCB

1.Detailed Specification of PCB Board Manufacturing

1 Layer 1-30 layer
2 Material FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,FR-1,FR-2,Aluminum
3 Board thickness 0.4mm-4mm
4 Max.finished board side 500mm*500mm
5 Min.drilled hole size 0.25mm
6 Min.line width 0.10mm(4mil)
7 Min.line spaceing 0.10mm(4mil)
8 Surface finish/treatment HASL/HASL lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold Plating
9 Copper thickness 1/2OZ 1OZ 2OZ 3OZ
10 Solder mask color green/black/white/red/blue/yellow
11 Inner packing Vacuum packing,Plastic bag
12 Outer packing Standard carton packing
13 Hole tolerance PTH:±0.076,NTPH:±0.05
14 Certificate ISO9001,ISO14001,ROHS,CQC
15 Profiling Punching Routing,V-CUT,Beveling
16 Assembly Service Providing OEM service to all sorts of printed circuit board assembly

2.Detailed Terms for PCB Assembly

Technical Requirement Professional Surface-mounting and Through-hole soldering Technology
Various sizes like 1206,0805,0603 components SMT technology
ICT(In Circuit Test),FCT(Functional Circuit Test) technology
PCB Assembly With CE,FCC,Rohs Approval
Nitrogen gas reflow soldering technology for SMT
High Standard SMT&Solder Assembly Line
High density interconnected board placement technology capacity
Quote&Production Requirement Gerber File or PCB File for Bare PCB Board Fabrication
Bom(Bill of Material) for Assembly,PNP(Pick and Place file) and Components Position also needed in assembly
To reduce the quote time, please provide us the full part number for each components,Quantity per board also the quantity for orders.
Testing Guide&Function Testing method to ensure the quality to reach nearly 0% scrap rate
OEM/ODM/EMS Services PCBA, PCB assembly: SMT & PTH & BGA
PCBA and enclosure design
Components sourcing and purchasing
Quick prototyping
Plastic injection molding
Metal sheet stamping
Final assembly
Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)
Custom clearance for material importing and product exporting
Other PCB Assembly Equipments SMT Machine: SIEMENS SIPLACE D1/D2 / SIEMENS SIPLACE S20/F4
Reflow Oven: FolunGwin FL-RX860
Wave Soldering Machine: FolunGwin ADS300
Automated Optical Inspection (AOI): Aleader ALD-H-350B,X-RAY Testing Service
Fully Automatic SMT Stencil Printer: FolunGwin Win-5

Factory Manufacture Capability

layer 1-20 layer
Material type FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
Board thickness 0.21mm to 7.0mm
Copper thickness 0.5 OZ to 6 oz
Size Max. Board Size: 580mm×1100mm
Min. Drilled Hole Size: 0.2 mm (8 mil)
Min. Line Width: 4mil (0.1mm)
Min. Line Spacing: 4mil (0.1mm)
Surface finishing HASL / HASL lead free, HAL, Chemical tin, Immersion Silver/Gold, OSP, Gold plating
Solder Mask Color Green/Yellow/Black/White/Red/Blue
Tolerance Shape tolerance: ±0.13
Hole tolerance: PTH: ±0.076 NPTH: ±0.05
Certificate UL, ISO 9001, ISO 14001
Special requirements Buried and blind vias+controlled impedance +BGA
Profiling Punching, Routing, V-CUT, Beveling

                                                                                                                                                                           Company Information

                                                                   Shenzhen Senyan Circuit Co., Ltd.

Shenzhen SenYan Co.,Ltd. is a professional PCB company that has single-sided, double-sided and multilayer PCBs. And we also specialize in manufacturing SMT,DIP and other special requirment PCBs,such as high precision half orifice circuit boards, impedance circuit boards and buried blind hole circuit boards.Meanwhile we can copy any PCB/PCBA according to our customer’s sample board...

If you have projects that need PCB, please don't hesitate to contact us, we will reply and prepare quote for you as soon as possible.

                                                                                 Specification
Layer
1-20 layer
Material Type
FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
Board Thickness
0.21mm to 7.0mm
Copper Thickness
0.5 OZ to 6 oz
Size(Custom)
Max. Board Size: 580mm×1100mm
Min. Drilled Hole Size: 0.2 mm (8 mil)
Min. Line Width: 4mil (0.1mm)
Min. Line Spacing: 4mil (0.1mm)
Surface Finishing
HASL / HASL lead free, HAL, Chemical tin,
Immersion Silver / Gold, OSP, Gold plating
Solder Mask Color
Green / Yellow / Black / White / Red / Blue
Tolerance
Shape tolerance: ±0.13
Hole tolerance: PTH: ±0.076 NPTH: ±0.05
Certificate
International Certification Standards
Special Requirements
Buried and blind vias+controlled impedance +BGA
Profiling
Punching, Routing, V-CUT, Beveling
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