In the circuit board manufacturing process, what is solder mask? What is flux? And what is the difference between the two? The role of protection, while the solder flux layer is used as a stencil. When tinning, the solder paste can be accurately placed on the patch pad that needs to be soldered.
The difference between circuit board solder mask and solder flux layer
The solder resist pad is the solder resist layer, which refers to the part on the PCB board to be painted with green oil. In fact, the solder mask layer uses a negative film output, so after the shape of the solder mask layer is mapped to the board, it is not coated with green oil solder mask, but the copper skin is exposed. Usually, in order to increase the thickness of the copper skin, the green oil is scribed on the solder mask layer, and then tin is added to increase the thickness of the copper wire.
The soldering layer is used when the machine is patched, corresponding to the pad of the patch component. In SMT processing, a steel plate is usually used to punch holes on the PCB corresponding to the component pads, and then put solder paste on the steel plate. , When the PCB is under the steel plate, the tin leaks down, and it happens that every pad can be stained with solder, so usually the solder mask cannot be larger than the actual pad size.
The difference between solder flux layer and solder resist layer of circuit board
Both layers are used for soldering. It does not mean that one is tinned and the other is coated with green oil, but:
1. The soldering layer is used for SMD packaging.
2. By default, the area without solder mask should be painted with green oil;
3. The solder mask means to open a window on the whole piece of solder mask green oil, the purpose is to allow welding;
