A multilayer circuit board is a multilayer wiring layer, with a dielectric layer between every two layers. The electrical connections between them are usually made through plated through holes in the cross-section of the board. Multi-layer circuit boards are the most used, accounting for more than 70% of the entire PCB board proofing. Let the editor explain the PCB multilayer circuit board in detail for you:
一. Advantages and disadvantages of multilayer circuit boards:
1. Advantages:
(1) Due to the high assembly density, the connection between each component is reduced, thus improving the reliability;
(2) The number of wiring layers can be increased, thereby increasing the design flexibility;
(3) It can form a circuit with a certain impedance, and can also form a high-speed transmission circuit;
(4) Simple installation and high reliability.
2. Disadvantages:
The cost is high; the cycle is long; the detection method with high reliability is required.
二. the difference between multilayer circuit board and double panel:
1. A multilayer PCB circuit board is a printed circuit board formed by laminating and bonding alternating conductive pattern layers and insulating materials. The number of conductive pattern layers is more than three layers, and the electrical interconnection between layers is realized through metallized holes.
2. Comparing the production processes of the two parties, the multi-layer board has added several process steps such as inner layer imaging, blackening, lamination, etchback and desmearing.
3. Multi-layer boards are more stringent than double-sided boards in terms of certain process parameters, equipment accuracy and complexity. For example, multi-layer boards have stricter requirements on the quality of hole walls than double-layer boards, so the requirements for drilling are even higher.
4. The number of stacked boards per drilling of multi-layer boards, the speed and feed rate of drill bits during drilling are different from those of double-sided boards.
5. The inspection of finished and semi-finished multi-layer boards is also stricter and more complicated than that of double-sided boards.
6. Due to the complex structure of the multi-layer board, the glycerin hot-melt process with uniform temperature is adopted; instead of the infrared hot-melt process that may cause excessive local temperature rise.
